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Forming Equipment Product List and Ranking from 14 Manufacturers, Suppliers and Companies | IPROS GMS

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

Forming Equipment Manufacturer, Suppliers and Company Rankings

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. コネクテックジャパン Niigata//Electronic Components and Semiconductors
  2. ダルトン Tokyo//Industrial Machinery
  3. 魁半導体 Kyoto//Educational and Research Institutions
  4. 4 SPD研究所 Shizuoka//Industrial Electrical Equipment
  5. 4 神港精機 東京支店 Tokyo//Industrial Machinery
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Forming Equipment Product ranking

Last Updated： Aggregation Period:Feb 18, 2026～Mar 17, 2026
This ranking is based on the number of page views on our site.

  1. Core technology supporting OSRDA: FSNIP コネクテックジャパン
  2. Porous silicon formation device (anodization device) ダルトン
  3. Conductive carbon thin film formation device (arc discharge sputtering device) 神港精機 東京支店
  4. "Glass coating 'thin film formation technology' at room temperature and atmospheric pressure [*Technical materials available!]” 魁半導体
  5. 4 SPD Film Formation Device KM-300 SPD研究所

Forming Equipment Product List

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Fusion of vacuum technology and FA (Factory Automation) core technologies! Support from design and manufacturing to assistance.

Fusion of vacuum technology and FA (Factory Automation) core technologies! Support from design and manufacturing to assistance.

Design and production of overlay devices, sealant application devices, and nitrogen replacement containers, special type GB.

We design and manufacture deposition equipment such as vapor deposition devices, sputtering devices, and CVD devices for semiconductors and various industries. We have a system in place that allows us to provide total services, including on-site delivery and setup after the completion of the equipment, as well as maintenance after it is operational. We also design and manufacture units such as exhaust sets. Additionally, we have extensive experience in designing various experimental support equipment and applying vacuum design, and we can assist from the specification consideration stage.

  • Vacuum Equipment
  • Forming Equipment

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Adhesion Test Now Accepting Applications - 'Uniform Coating Film Formation Device'

Adhesion Test Now Accepting Applications - 'Uniform Coating Film Formation Device'

Charge fine particles like piles with static electricity and instantly adhere them to a substrate coated with adhesive!

The "Uniform Coating Film Formation Device" is a device that uses static electricity to charge piles and glass beads, allowing them to adhere to paper or fabric that has been coated with adhesive. It is used in combination with a compact high-voltage power supply from the "GT series." The substrate coated with adhesive is placed on the upper electrode plate, while the fine particles to be adhered are placed on the lower electrode plate. By applying high voltage between the upper and lower electrodes, the particles are uniformly adhered. If you send us a sample, we can also conduct adhesion tests. 【Features】 ■ Adhesion is completed in an instant ■ Can form a single-layer coating film ■ Compatible with various particles, piles, and glass beads *For more details, please download the catalog or contact us. 　　　　　　　　　＜Free Demo Available＞ If you visit Green Tech, we will provide a free demonstration of the actual device. If you would like to "see the lineup" or "test/verify with the actual device," please contact us using the information below. *We also accept contract production of high-voltage power supplies. Please inquire first.

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  • others
  • Processing Contract
  • Forming Equipment

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Conductive carbon thin film formation device (arc discharge sputtering device)

Conductive carbon thin film formation device (arc discharge sputtering device)

Conductive carbon thin films are formed by sputtering. Stable film formation is achieved through a simple process with inert gas and carbon target at low temperatures (below 400°C).

Using the independent high-density sputtering method, conductive carbon thin films are formed through a process equivalent to metal film deposition via arc discharge magnetron sputtering (ADMS method). Compared to conventional sputtered carbon thin films, these films are characterized by significantly higher density and adhesion. Due to their conductive properties and film stability, they are suitable for new fields such as energy and biosensors. Conductive carbon thin films excel in hardness and surface smoothness, making them applicable for surface treatment of mechanical parts (tribological applications) due to their high adhesion to metals.

  • Sputtering Equipment
  • Plasma surface treatment equipment
  • Other processing machines
  • Forming Equipment

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Electronic circuit formation device

Electronic circuit formation device

This device is equipment for continuously developing resist films on various types of films in a roll-to-roll process after the exposure process.

If you have any questions, please feel free to contact us.

  • Printed Circuit Board
  • Forming Equipment

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Porous silicon formation device (anodization device)

Porous silicon formation device (anodization device)

A porous silicon formation device that further applies conventional anodic oxidation equipment. Porous silicon wafers are formed depending on the chemical solution used and the current density.

The anodizing device was traditionally a device that flowed current to form an oxide film, but the further developed porous silicon formation device is one that forms porous silicon by changing the chemical solution used and the current density. *For more details, please download the PDF (catalog) or feel free to contact us.*

  • CVD Equipment
  • Forming Equipment

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"Glass coating 'thin film formation technology' at room temperature and atmospheric pressure [*Technical materials available!]”

"Glass coating 'thin film formation technology' at room temperature and atmospheric pressure [*Technical materials available!]”

Thin film formation at room temperature and atmospheric pressure! Using inexpensive film materials! Immediate delivery campaign ongoing.

Glass thin films are formed in a room temperature and atmospheric pressure environment. Due to its high reflowability, it is suitable for forming thin films on uneven surfaces. There is minimal loss of film materials, and it can be formed with inexpensive materials, allowing for cost reduction! It is ideal for forming protective films on glass alternative polycarbonate, screen protectors for mobile phones, and hydrophilic coatings. *Currently, we are holding an "Immediate Delivery Campaign"! We offer our equipment, including thin film formation devices, with astonishingly short delivery times. For more details, please download the catalog. **Features** - Thin film formation at room temperature and atmospheric pressure! - High reflowability makes it suitable for forming thin films on uneven surfaces! - Minimal loss of film materials! Can be formed with inexpensive materials! **Examples of Applications** - Formation of protective films on glass alternative polycarbonate! - Screen protectors for mobile phones! - Hydrophilic coatings! - Pre-treatment coatings for painting, printing, and coating! *For details on thin film formation technology or the immediate delivery campaign, please contact us or download the catalog from the link below.*

  • Other processing machines
  • Coater
  • others
  • Forming Equipment

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SPD Film Formation Device KM-300

SPD Film Formation Device KM-300

Removable and capable of automatic operation, a powerful exhaust and powder separation system!

The SPD film formation device KM-300 is compatible with 300mm square substrates and uses three spray nozzles with a special scanning pattern to achieve uniform film formation in a short time. It features powerful downward exhaust and a powder separation system, allowing for easy removal and cleaning, or automatic operation. For more details, please contact us or download the catalog.

  • Separation device
  • Forming Equipment

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SPD Research Institute, Inc. - Business Introduction

SPD Research Institute, Inc. - Business Introduction

We will challenge ourselves to create innovative and high-value-added products that meet your needs!

SPD Research Institute, Inc. is a company engaged in the manufacturing and sales of SPD thin film formation equipment, as well as the development of next-generation thin film solar cells. Our company aims to provide energy supply using various thin films produced by chemical thin film formation technology, along with the production of devices related to this technology, and to develop new dye-sensitized solar cell systems that contribute to environmental conservation. In the fields of energy and the environment, we challenge ourselves to create innovative and high-value-added products that meet customer needs, contributing to society together with our clients. [Business Introduction] ■ Manufacturing and sales of SPD thin film formation equipment, DSC and PSC prototype equipment, FTO transparent conductive films, etc. ■ Development of next-generation thin film solar cells ■ Contract research and development of prototypes related to thin film application devices ■ Development of DSC continuous production systems For more details, please refer to our catalog or feel free to contact us.

  • Power Monitoring Equipment
  • Forming Equipment

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WaveFormer

WaveFormer

3D solid wave structure using wave formers! Reproducing more flexible and diverse functions.

"WaveFormer" continuously forms a stable pleated wave in non-woven fabric material through the interlocking of numerous segmented gear rolls arranged vertically, simultaneously providing cushioning and increasing surface area. By employing a number of vertically moving segmented gear rolls and a movable guide bar, it is possible to adjust the pleat width within a certain range without replacing the gear rolls. The processing is chemical-free and metal-free, using only resin gear rolls and hot air. 【Features】 ■ Adjustable pleat width change ■ Double wave processing ■ Wave density setting ■ Eco-friendly design *For more details, please refer to the PDF document or feel free to contact us.

  • Circuit board design and manufacturing
  • Mechanical Design
  • Forming Equipment

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[Kansai Manufacturing Selection 2023 Selected!] Precise & Smooth Film Formation Device

[Kansai Manufacturing Selection 2023 Selected!] Precise & Smooth Film Formation Device

The 'Arc Discharge Magnetron Sputtering Device' that achieves an astonishingly precise and smooth reaction film.

We would like to introduce our "Arc Discharge Type Magnetron Sputtering Device." By adding a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism, the amount of ions incident on the substrate has increased tenfold compared to conventional devices, allowing for the formation of dense, hard, and smooth reaction films at an industrial level. Additionally, the elimination of the need for finishing polishing on the coating surface has improved durability and contributed to energy savings. 【Features】 - Addition of a low-voltage, high-current arc discharge mechanism to the front of the magnetron sputtering mechanism - Ten times more ions incident on the substrate compared to conventional devices - Formation of dense, hard, and smooth reaction films at an industrial level - No need for finishing polishing on the coating surface - Improved durability and contribution to energy savings *For more details, please refer to the PDF document or feel free to contact us.

  • Other physicochemical equipment
  • others
  • Forming Equipment

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Broken surface steam protective film forming device

Broken surface steam protective film forming device

Protect the fracture surface caused by material brittle failure as it is! Various analyses of the fracture surface can be performed.

The "Fracture Surface Vapor Deposition Protective Film Formation Device" is a device developed for performing vacuum deposition of materials such as nickel on fracture surfaces immediately after mechanically fracturing various metals and alloy materials at ultra-high vacuum (X10-9Pa) and low temperatures (~100K). This allows for the direct protection of fracture surfaces resulting from brittle failure, enabling various analyses of the fracture surfaces through techniques such as three-dimensional atomic probe observation. Please feel free to contact us if you have any inquiries. 【Components】 ■ Main chamber ■ Sample exchange chamber ■ Vacuum exhaust system ■ Ultra-high vacuum gauge ■ K-cell type evaporation source *For more details, please refer to the related links or feel free to contact us.

  • Other physicochemical equipment
  • Forming Equipment

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Atmospheric Pressure Thin Film Formation Device TEOS+O3-100

Atmospheric Pressure Thin Film Formation Device TEOS+O3-100

Forming glass thin films in room temperature and atmospheric pressure environments!

The formation of glass thin films has become possible in room temperature and atmospheric pressure environments. It can be processed for a wide range of objects, from mobile phone protective films to glass. Efficient painting is also possible with a small amount of paint!

  • Other processing machines
  • Forming Equipment

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Clean Zone Device KOACH T 500-F Rental

Clean Zone Device KOACH T 500-F Rental

A clean space is realized in an open environment! Bench-type clean zone equipment.

The KOACH T 500-F is a clean zone formation device that allows for easier high-definition purification of tabletop spaces. (Equipped with FERENA / Original ultra-precision filter) It has a proven track record in many research and testing institutions. Born from a shift in thinking that involves opposing push hoods, it has realized an open clean zone that does not require surrounding or partitioning. Relocation and layout changes are simple. 【Features】 ○ The flexible hose allows for visualization of the local airflow conditions around the equipment. ○ For contamination control, only the necessary areas indoors can be locally purified. ○ The opposing airflow suppresses the attraction of surrounding air, so there is hardly any decrease in cleanliness within the zone even at positions away from the discharge surface. ○ After turning on the switch, an ISO Class 1 open super clean zone can be formed in just 110 seconds, anywhere and anytime. For more details, please contact us or download the catalog.

  • Rental/lease
  • Forming Equipment

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Optical Thin Film Formation Device Genesis-AR Series

Optical Thin Film Formation Device Genesis-AR Series

Ideal for film formation on high curvature lenses and ball lenses, which is difficult with sputtering.

In the optical thin film process, by using the ALD (Atomic Layer Deposition) method, which is different from the commonly used deposition and sputtering techniques, it has become possible to form high-quality thin films with excellent conformity on substrates such as ball lenses and high-curvature lenses, which have been considered difficult until now. 【Overview】 ○ Up to 50 φ10 inch substrates can be processed at once (25 substrates × 2 axes) 　* This varies depending on the substrate shape and conditions. ○ Equipped with a substrate rotation mechanism.

  • lens
  • Forming Equipment

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Core technology supporting OSRDA: FSNIP

Core technology supporting OSRDA: FSNIP

Can be manufactured with small devices and in small area factories! Achieving an excellent method that does not cause alignment shifts.

We would like to introduce our technology, 'FSNIP (Free Substrate material Narrow pitch Imprinted Process).' By transferring conductive paste onto a substrate using the imprinting method, we can simultaneously form wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm. Due to the transfer wiring method, it can be manufactured with low-cost equipment and in small area factories, and because wiring and bumps are formed simultaneously, it achieves an excellent method that does not result in alignment shifts. 【Features】 ■ Transfer of conductive paste onto the substrate using the imprinting method ■ Simultaneous formation of wiring and bumps with a pitch of 40μm or less, with a minimum pitch of 10μm ■ Can be manufactured with low-cost equipment and in small area factories ■ No alignment shifts occur *For more details, please refer to the PDF document or feel free to contact us.

  • Special Processing Machinery
  • Forming Equipment

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Vacuum film formation devices and surface analysis devices: Years of cultivated vacuum technology in this one book!

Vacuum film formation devices and surface analysis devices: Years of cultivated vacuum technology in this one book!

Years of cultivated vacuum technology! A product lineup related to vacuum equipment and scientific instruments!

This is the comprehensive catalog of Pascal Corporation, which possesses a global perspective in vacuum machinery and equipment, as well as physical and chemical instruments and devices. We constantly focus on the forefront of the times, anticipate new technologies and product needs, and continue to provide products that are beneficial to our users. We offer a lineup that includes the time-of-flight atomic scattering surface analysis device "TOFLAS-3000," which enables the polarity discrimination and structural analysis of insulator surfaces, element identification, and in-situ analysis in electric and magnetic fields—capabilities that were impossible with conventional ion scattering surface analysis devices—as well as "vacuum thin film formation devices" and "surface analysis devices." [Excerpt of Contents] ■ Vacuum devices and components ■ Surface analysis devices ■ Low-temperature related equipment ■ Agilent vacuum equipment (formerly Varian) ■ Other vacuum-related products, etc. *For more details, please refer to the PDF document or feel free to contact us.

  • Vacuum Equipment
  • Analytical Equipment and Devices
  • others
  • Forming Equipment

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Formation of stud bumps

Formation of stud bumps

We will accommodate various stud bump processing according to your specifications.

Stud bump processing is essential in flip chip mounting technology. Our company can form stud bumps even from a single wafer. We can also process two-tier bumps. We provide leveling support. We can accommodate wafer sizes up to a maximum of 12 inches. We support individual chips, bare wafers, tape-mounted wafers, and reconstructed wafers.

  • Wafer
  • Forming Equipment

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